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Offers a low profile height (≤ 7.50mm) and is based on very cost effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from FCI.
Incorporates an innovative power contact and housing design that permits a more compact and lower profile package for demanding AC and DC power supply and/or add-in card applications. HPCE’s low profile height (for maximized airflow), significantly increased linear current density and low contact resistance characteristics are ideal for next generation 1U/2U servers, storage enclosures, telecommunications equipment and datacom/networking equipment.
Is available with power and signal contacts integrated into a single molded housing for power distribution and power control. Similar to other FCI power solutions, HPCE™ is modularly tooled, making the product highly configurable in terms of the number and placement of the power and signal contacts for custom power needs.
Features & Benefits
Current rating to 9A/power contact beam (with multiple power contacts fully energized) without exceeding a 30°C temperature rise in still air
Low ≤ 7.50mm profile height maximizes airflow for effective system cooling
One-piece assembly enables cost-effective power delivery for 1U and 2U power supplies or power distribution applications