FCI's High Power Card Edge (HPCE™) connector is designed for demanding applications requiring high linear current density and low power loss.
HPCE™
- Offers a low profile height (≤ 7.50mm) and is based on very cost effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from FCI.
- Incorporates an innovative power contact and housing design that permits a more compact and lower profile package for demanding AC and DC power supply and/or add-in card applications. HPCE’s low profile height (for maximized airflow), significantly increased linear current density and low contact resistance characteristics are ideal for next generation 1U/2U servers, storage enclosures, telecommunications equipment and datacom/networking equipment.
- Is available with power and signal contacts integrated into a single molded housing for power distribution and power control. Similar to other FCI power solutions, HPCE™ is modularly tooled, making the product highly configurable in terms of the number and placement of the power and signal contacts for custom power needs.
