Product Specification: The iLGA package, utilized on the new OKL-T/3-W12 series, features small plated cutouts (castellations) that allow probing and visual inspection of all signal pads, which is not possible with conventional LGA confi gurations. The iLGA package enables excellent heat management characteristics, wherein the large copper pads provide a very low thermal impedance path between the module and the board onto which it is mounted.
