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Embedded Systems

18 Posts tagged with the embedded tag
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Joe Alderson reports from Embedded World 2012 in Nuremberg:

 

 

With a rare chance to leave the Farnell/element14 stand and take a trip around the rest of the exhibition, the final day of Embedded World 2012, intended for students and academics, really brought home the incredible level of knowledge among young engineers who are just finishing university and heading out into the work-a-day world.  Young engineers were present at many of the stands, demonstrating proficiency with the applications they were showcasing. Many of them had started with simple 8-bit MCUs, using boards like the Arduino Uno, and were now experts working with products from ARM, Intel, AMD, Microsoft and too many others to list.

 

Looking at the young people at Embedded World I was reminded that society has now seen multiple generations of computer gamers and, I’m relieved to say, these gamers have left a positive impact on today’s technology. One outgrowth of gaming-driven technology could be seen in the Microsoft exhibit, where the Xbox manufacturer was demonstrating projected touch screen technology (think of the film Minority Report), while plenty of the autonomous RC cars demonstrated elsewhere ran real-time 3D models and transmitted back camera feed from multiple angles.

 

One of the many great student projects that I saw included object recognition and augmented reality gaming, where real world objects were used as walls in virtual games with computer generated balls bouncing between them. Other young engineers, this time having constructed a giant chess playing robot guided by ultrasound, were keen to demonstrate how they had integrated Atmel’s 8-bit MCU and ubiquitous demo board (I’ll leave you to guess which one) into the motor control system.

 

As I checked out more and more development boards, their increasing level of connectivity really struck me and it’s no surprise that the Embedded World internet backbone was creaking under the weight of many thousands of web-connected demo boards, laptops and mobile devices. A mighty download speed of 9 kb/s made it quite challenging to get a true measure of the functionality of some of the more powerful development kits as they were running apps that relied on APIs from various Internet locations. However, given the popularity of touch screens (both capacitive and resistive) across so many different applications, I think it’s safe to say that the next 2 – 3 years will see massive growth in every day devices making use of this technology.

 

 

At the Philips stand, even the humble washing machine was interfaced with wireless connectivity and a touch screen in order to monitor and improve motor efficiency. I’d initially thought that the idea would be to implement smart control of the washing machine so that it could be activated remotely, but the real goal was increasing energy efficiency and extending the product’s life span.

 

This drive towards energy efficiency and green technology really impressed me at Embedded World this year, with many of the exhibiting companies placing emphasis on what you can do with only a couple of Watts, rather than what you can do by cramming a massive heat sink on your processor. Of course for this reason ARM seemed to be everywhere at Embedded World 2012. From the autonomous Zeppelin circling above the press area to the smart vending machine on the ARM stand to well over half of the development boards that we were showcasing, ARM cores were the most outwardly obvious sign of the emphasis shifting from energy hungry processors to silent, powerful and well designed cores.

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The traditional approach to picking silicon involves data sheets; matrices of features; at best, a complex spreadsheet of all the many parts with all the many options laid out. Let’s call this the “top down” approach. You have to already be somewhat familiar with the universe of parts. Then you have to see if the part fits your need. Does it have SPI? Does it support JTAG? Can it support the touch capacitive screen your team wants? Even when it all comes together, how do you know that it can do SPI and JTAG simultaneously? What if those subsystems use the same pins? It’s ugly. You know it is.
Enter Solution Advisor from Freescale. Right now it covers the Kinetis MCU parts. This online tool takes a different approach. Let’s call it “bottom up.” Instead of attacking the problem from the top down perspective by starting with what we have, the bottom up perspective tackles the problem from your point of view. The question then becomes: What do I want? What do I need to do this? That basic assumption makes a world of difference. Suddenly you are freed from knowing anything other than what you already know: your design parameters. Hallelujah! That is good human-centered design.
So fill in the blanks. You need a segment LCD? Click and go. Need SPI capability? Just say so. Click the module you need on the left, and the Solution Advisor pops up a configuration window that lets you specify capabilities (Figure 1).

By Jim Trudeau

 

I admit it. I’m a sucker for a good human interface. So we’re going to depart from our usual software focus just a little bit. My excuse is that we’ll talk about a tool that gives you a better way to pick silicon based on a better human interface into the whole process. We are all about good solutions here.

 

The traditional approach to picking silicon involves data sheets; matrices of features; at best, a complex spreadsheet of all the many parts with all the many options laid out. Let’s call this the “top down” approach. You have to already be somewhat familiar with the universe of parts. Then you have to see if the part fits your need. Does it have SPI? Does it support JTAG? Can it support the touch capacitive screen your team wants? Even when it all comes together, how do you know that it can do SPI and JTAG simultaneously? What if those subsystems use the same pins? It’s ugly. You know it is.

 

 

Enter Solution Advisor from Freescale. Right now it covers the Kinetis MCU parts. This online tool takes a different approach. Let’s call it “bottom up.” Instead of attacking the problem from the top down perspective by starting with what we have, the bottom up perspective tackles the problem from your point of view. The question then becomes: What do I want? What do I need to do this? That basic assumption makes a world of difference. Suddenly you are freed from knowing anything other than what you already know: your design parameters. Hallelujah! That is good human-centered design.

 

So fill in the blanks. You need a segment LCD? Click and go. Need SPI capability? Just say so. Click the module you need on the left, and the Solution Advisor pops up a configuration window that lets you specify capabilities (Figure 1).

 

http://freescalehome.files.wordpress.com/2011/08/image1.jpg?w=578&h=276

 

Figure 1. Pick the capabilities the product design requires.

 

 

You can specify voltage, temperature range, package, and memory. The FlexBus interface is particularly sweet, and worthy of a picture (Figure 2). Again, we’re talking an intuitive human interface here that lets you define what you need based on how you think and see, not on a dry list of numbers or register diagrams

 

http://freescalehome.files.wordpress.com/2011/08/image2.jpg?w=578&h=336

 

Figure 2. Specifying the characteristics of the bus that ties everything together.

 

 

You mix and match the design elements as you will. The list of potential controllers that fit your needs changes automatically based on your choices. If it drops to zero, you are warned immediately – yet another great human interface touch (Figure 3).

 

Figure 3. Uh oh! Now you’ve done it.

 

 

When you’re done, you can pick a 100 percent solution, or a non-preferred solution (you’re a grown up). Once you’ve picked the processor, you can check the pin muxing to see if your particular choice of modules work together (Figure 4). Talk about cool – within a minute or two you know if your design is going to have problems. (I purposefully set this up to show you a failure case.)

http://freescalehome.files.wordpress.com/2011/08/image4.jpg?w=578&h=271

Figure 4. Sorry, these components won’t play together in the same box.

 

 

Continue reading on Software Meets Silicon blog

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So back in November 2009 I posted an article about my starting to play around with RTOS to grow in my technical knowledge. I must confess something: I haven’t really played with MQX or others as much as I would have liked…at least not during 2010. But then something happened: Freescale’s Kinetis family of ARM microcontrollers was launched and now my worked has forced me (in a good way) to work with the MQX RTOS quite a lot more. It’s been great fun.
In my self-training of MQX I’ve run into basically two ways of doing things. One way is to subdivide all functions into tasks, using all sorts of RTOS goodies like semaphores, priorities and mutexes (is that the right plural? How about mutexii?). This way, as far as I understand RTOS, is the right way to do it, it’s elegant.
On the other hand, I’ve seen code were the author basically creates two or three tasks and then proceeds to manually do the application control manually i.e.: switch-case statements with binary flags and stuff. Almost as doing a bare metal application where the RTOS is only there for the drivers. Correct me if I’m wrong, but, doesn’t that beat the whole purpose of using an RTOS?

So back in November 2009 I posted an article about my starting to play around with RTOS to grow in my technical knowledge. I must confess something: I haven’t really played with MQX or others as much as I would have liked…at least not during 2010. But then something happened: Freescale’s Kinetis family of ARM microcontrollers was launched and now my worked has forced me (in a good way) to work with the MQX RTOS quite a lot more. It’s been great fun.


In my self-training of MQX I’ve run into basically two ways of doing things. One way is to subdivide all functions into tasks, using all sorts of RTOS goodies like semaphores, priorities and mutexes (is that the right plural? How about mutexii?). This way, as far as I understand RTOS, is the right way to do it, it’s elegant.

 

 

Continue reading on EmbeddedStories blog

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Embedded software engineers only need to know one programming  language to get through life: C. Most embedded software projects are  written in C. So that leaves most other languages out of use (I insist,  for embedded programmers). I always wonder if I need to start learning a  new language, and if so, which one. With so many things to keep  learning about, I usually barely have time to read up on the latest  developments in the technologies I work with, so learning a new language  has been constantly left “for later”.


C++ seems to be a pretty obvious choice as a next programming  language, as far as I know, it’s the second most used language in  embedded systems. There are also some less obvious choices out there  like Ada or B# (yes, you read correctly).


 

Continue reading on EmbeddedStories blog

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Going into the 2011 Embedded Systems Conference Silicon Valley I was looking forward in particular to seeing and hearing more about new MCUs and ecosystem developments.


The show did not disappoint.


If there was one product to capture “best in show” honors a good argument could be made on behalf of TI’s MSP430FR57xx, a 16-bit microcontroller said to be the industry's first low power ferroelectric random access memory (FRAM) MCU. TI has been working on FRAM technology for about a decade, but this is the first time that the memory has been integrated into a microcontroller. The new MCU is said to reduce active power by up to 50 percent when executing code from FRAM,  operating at 100 µA/MHz in active mode and 3 µA in real-time clock mode.


What’s more, the on-chip FRAM allows data retention in all power modes, supports more than 100 trillion write cycles, and allows developers to partition data and programming memory with changes in software.


For product designers, the new technology provides the ability to deploy and monitor sensors for years at a time. TI engineers foresee it being used on many of the country's 600,000 bridges, or on other types of remote structures where safety and security is critical.

Microchip Technology has expanded its 8-bit Enhanced Mid-range Core product portfolio with the new, PIC16F1516/7/8/9 and PIC16F1526/7 (PIC16F15XX). MCUs. These new, general-purpose MCUs feature Microchip’s eXtreme Low Power (XLP) technology—for sleep currents down to 20 nA, and active currents less than 50 micro Amperes/MHz, according to the company—which lowers overall power consumption and extends battery life.


This MCU family offers 5V operation, which is important for many home appliance and automotive applications. An on-chip, 10-bit Analog-to-Digital Converter (ADC) with up to 30 channels enables more mTouch capacitive touch-sensing keys and sliders in smaller packages. Up to two each of EUSART, I2C and SPI ports enable communication with on-board peripherals. The new MCUs are available in 28-, 40-/44- and 64-pin packages.


Renesas Electronics America announced new support for its RL78 microcontroller family including compiler support from IAR Systems, real-time operating systems (RTOS) from Micrium and CMX Systems, and Wi-Fi (802.11n) support from Redpine Signals. IAR Systems' Embedded Workbench provides an optimized C and C++ compiler for the RL78 MCU family and supports the E1 on-chip debugger and IECube in-circuit emulator tools, both from Renesas Electronics. Additionally, the Embedded Workbench comes bundled with C-SPY real-time debugger, and the instruction simulator.

 

 

 

Micrium's compact and scalable µC/OS-II and µC/OS-III kernels have been ported to the RL78 family of processors so power-sensitive and environmentally conscious applications can further benefit from Micrium's µC/OS-II's and µC/OS-III's ability to enter the RL78 MCUs' SNOOZE and HALT modes when idling.

 

 

 

Similarly CMX Systems has ported its CMX-RTX operating system to Renesas Electronics' RL78 MCU family and Renesas and Redpine Signals have jointly developed 802.11a/b/g/n wireless-connectivity solutions to add low-power, single-stream 802.11n Wi-Fi capability to embedded systems that use Renesas Electronics' RL78 MCUs.

 

 

 

Contest Winners, Too


At ESC STMicroelectronics and EE Times  announced the winning design of the STM32 Design Challenge. Community members rated and voted from an original pool of nearly 200 designs submitted in the competition. Winners were chosen from ten finalists with the most imaginative and innovative solutions using the STM32 Discovery Kit, which was given away free to registered contestants.


Taking the title of Grand Prize Winner was Nghia Tran with Navicane, a talking navigation cane intended for use by visually impaired individuals. The goal of the design was to provide navigation information via audible messages and haptic feedback, helping users localize where they are and where they are headed, while improving overall mobility and decreasing dependency upon other resources. Included in this design were a magnetometer, accelerometer, proximity sensor, GPS, light and temperature sensors, audio codec and more. Mr. Tran was awarded $3,500 in addition to a free conference pass to attend ESC.


Honorable Mentions include the Delta Robot Clock by Justin Smith, a standard digital display on the end actuator of a delta robot; the eDiaper by Lakshmi Balasubramanian, an intelligent and hygienic moisture detection unit that alerts caregivers when to change a diaper; and a House Wide Audio System by David Erickson that included 8 inputs and up to 8 channels. Each Honorable Mention recipient received $1,000.


Freescale Semiconductor took the occasion of ESC to announce its “Make It Challenge”. Engineers enter the contest by enrolling in a hands-on workshop, where they receive a free biped robot replete with Freescale sensors and they are tasked with creating a unique mechatronics application. There is a $12,000 contest purse.


The Freescale Robot (FreeBot) is a 4-degree-of-freedom biped walking robot controlled by a Tower mechatronics board housing a 32-bit ColdFire microcontroller, 64k of RAM and 512k of flash. Four pulse-width-modulated RC servos work the leg mechanics for the FreeBot, with accelerometer, touch and other Freescale Xtrinsic sensors available via plug-in daughterboards.


The Make It Challenge live competition will take place at the Freescale Technology Forum, slated for June 20-23 in San Antonio.


Wozniak Assails U.S. Education


In a fireside chat format Q and A session with Brian Fuller of EE Times, Steve Wozniak, one of the original co-founders of Apple delivered the keynote at the Embedded Systems Conference (ESC) and was highly critical of the American education system, particularly math, science and engineering education, suggesting at one point that that the American public schools had outgrown their usefulness.

Wozniak, currently chief scientist at Fusion-io, described American education as stagnant, testing-obsessed and destructive of creativity. He said children in American schools, crowded into large classes, where they are pressured to complete and pass statewide and national standardized tests. “They’re not allowed different ways to think” he said adding that they become discouraged. Wozniak said his own children had attended public schools, but conceded, “I actually think home-schooling is very, very good as an alternative” and suggested that middle-class parents send their children to private schools.


Wozniak noted that over an eight year period during his career he spent some eight years “secretly” teaching at the middle and high schools levels

 

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5 times the density in ICs

Posted by Eavesdropper Mar 29, 2011

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Copper based ICs have reached nano-meter densities, with wire so small, that no current seizes to flow. The University of Cambridge professors John Robertson and Santiago Esconjauregui have devised a possible future solution. They are growing Carbon Nanotube in greater density than ever before, up to 5 times the most current working technology.


 

Through the annealing step, the deposit of catalyst onto a substrate are heated creating groupings of nanoparticles. The next step grows the nano-tubes. Normally, this process does not yield tubes that can carry sufficient amounts of current for use in ICs. But in the professor's case that place multiple deposits and annealing, produces bundles of nano-tubes capable of handling the current necessary. They claim that even higher densities are possible.


 

This is good step towards Carbon Nano-Tubes replacing copper in microchip manufacturing, but controlling the positions and laying out an actual circuit with Robertson and Esconjauregui's achievement has not been shown. And, they are only 2 people.


 

Which brings me to a realization. With so many people working with carbon nanotube and like technology, they all need to be pulling in the same direction. A global initiative will take us all into the future, now. Just a thought.


 

Eavesdropper

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Self-repairing processor

Posted by Eavesdropper Mar 21, 2011

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CRISP has developed a multi-core processor that will test and repair itself, sort of. There is an on-board resource manager that will test to see if a core is malfunctioning, and if so, send the tasks to a functioning core. The idea is to create a chip that will always work 100% of the time regardless of internal component failures. ‘‘Because of the rapidly growing transistor density on chips, it has become a real challenge to ensure high system dependability. The solution is not to make non-degradable chips, it's to make architectures that can degrade while they keep functioning, which we call graceful degradation. With the right dependability infrastructure many-cores can be a solution', says Hans Kerkhoff accociate professor at the University of Twente.


 

Still in the design, prototype, stage, this technology may very well be the standard future of chip design. My old critic is what is the "resource manager" gets corrupted due to a bad core? I'm sure more details will emerge over time on how they will handle such events.


 

CRISP stands for Cutting edge Reconfigurable ICs for Stream Processing. It is a collaborative effort from the University of Twente, Tampere University of Technology, Thales Netherlands, Recore Systems, Atmel, and NXP at the moment.


 

Eavesdropper

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xim3production0.jpg

 

The XIM 3 stand for XBOX Input Machine version 3. For those  who do not know, the XIM 3 allows for a keyboard, mouse, joystick, and other USB based devices to be adapted to the console. But that is not the end of the device's features. In many games a little autoaim functionality is added to help the player aim using a controller, since the controller is not the most precisely controlled input device. The XIM 3 has onboard software called "Smart Translators" that takes a particular game's aiming and movement actions and attempts to remove any autoaim and movement aids to give a PC like keyboard and mouse feel. Let's take a look at this achievement from the inside.


SDC11274.JPGSDC11275.JPG

 

The device is stylish and does not feel cheap. The casing, a dense plastic, sits the screen at an angle allowing the player to see the information while seated as if at a desk, within the LCD's viewing angle. 3 A type USB ports are on the back for, presumably, a keyboard, mouse, and XBOX controller. The XBOX controller is needed, ultimately, for sending the control signals to the console. The XBOX addresses a controller and expect signals. The XIM piggybacks on the controller signal. A mini usb port is present for a connection to the XBOX console itself. A barrel plug for a power adapter is also present, which may be needed at a user adds a USB hub for more devices.


SDC11277.JPG

 

The XIM 3 shell is held together with 2 visible screws and two underneath foot-pads. Inside shows the screen ribbon cable connected to the mainboard on the base. The screen model number is SG100331. Ribbon cable is marked TS8001S FKJ40010 V1.0. The LCD is a QVGA panel


SDC11278.JPGSDC11280.JPG

 

The mainboard has a model name HDDC3C02 made by HDDC inc. No information could be found on the company or model number. However, the central microcontoller is a NXP - LPC1768FBD100. A cortex M3 100Mhz 32 Bit ARM processor with 65KB RAM and 512KB program memory space. On the mainboard is a Texas Instruments TUSB2046B 4-port Full-Speed USB Hub, hence XIM3's 4 ports. (The hub requires 3.3V, the assumption is that the NXP ARM is also run at the same voltage.) Also present is a MAX3421EE USB peripheral host controller with SPI interface. This controller digital logic and analog circuitry necessary to implement a full-speed USB peripheral, or in this case the T.I host controller. (Supply voltage for the MAX chip is also 3.3V) Not to surprise anyone, but a LD33 F022 (3.3V) linear voltage regulator powers the whole system. My only complaint about the system are the experience I had with the 3 main USB ports. It was easy to bend a pin out of place, impeding cable inserts. However, I bent the pins back in place, and all was well.


SDC11279.JPG

 

 

There is no additional memory, so the entire program sits in 512KB. Overall, it is an impressive design, circuit, packaging, and the code must be exquisite. This is an example of only one person accomplishing an amazing feat on his own. Inspiration to all of us and our ideas.


 

XIM 3 units are finally available at the XIM Technologies website on a regular basis. When the XIM was first released, the attention and web traffic was so great that it crashed the servers. After the website's servers were upgraded, "OBsIV" the creator of XIM, would only open the store privately for short periods, like 5 minutes. The only way to the store was knowing the direct address, and was not available from the home page. Some people were using other services, like "alertbox," to monitor when the site would open. Eventually, everyone who desperately wanted one, now has one. For the record, the one pictured above was purchased in a 5 minute window in February.


 

Want to know how the device performs in games? I will relate my experiences in an up and coming post.


 

Cabe

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Missouri University of Science and Technology is resolved to make a handheld scanner that can see through anything. Similar to airport scanners, this hand held camera used millimeter and microwave signals to peek inside. In real time, this camera takes 30 frames per second and can construct a representation of objects at different layers. No word on the depth it can go, but the team calls it “non-intrusive.” Originally conceived Dr. Reza Zoughi in 1998, the first prototype was made in 2007. Since then the design has been made smaller and more portable. Currently the system runs off of a battery about the size of a laptop power cell. Zoughi said about the product’s future, “Further down the road, we plan to develop a wide-band camera capable of producing real-time 3-D or holographic images." As of 2010, this concept is patented. At the moment, objects to be scanned have to pass between the camera and a backplane. The team is hard at work to eliminate the pass through feature and just make it a camera. Although modesty will soon be a thing of the past, it is an impressive achievement.


Eavesdropper

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A complete computer system in 1 cubic millimeter. Onboard is a low power microcontroller, memory, battery, wireless radio, solar cell, and a pressure sensor. This system is meant to be an implantable eye pressure monitor for glaucoma patients. I'm sure a patient would feel this think, despite the size. Think about getting a splinter. Created by three professors from the University of Michigan, Dennis Sylvester, David Blaauw, and David Wentzloff, the project was presented at the International Solid-State Circuits Conference (ISSCC) in San Francisco.

 

"Our work is unique in the sense that we're thinking about complete systems in which all the components are low-power and fit on the chip. We can collect data, store it and transmit it. The applications for systems of this size are endless," Sylvester said.

 

Blaauw said, "When you get smaller than hand-held devices, you turn to these monitoring devices." He continued, "The next big challenge is to achieve millimeter-scale systems, which have a host of new applications for monitoring our bodies, our environment and our buildings. Because they're so small, you could manufacture hundreds of thousands on one wafer. There could be 10s to 100s of them per person and it's this per capita increase that fuels the semiconductor industry's growth."

 

Wentzloff, speaking of the onboard antenna, "This is the first integrated antenna that also serves as its own reference. The radio on our chip doesn't need external tuning. Once you deploy a network of these, they'll automatically align at the same frequency."

 

The system uses an aggressive sleep mode scheme. It wakes every 15 minutes to take readings at about 5.3 nanowatts. The battery charges in 1.5 hours of sunlight, or 10 hours of indoor lighting. But if it is implanted, how can this happen? It can store up to a week's worth of data.

 

See more about the team at their personal sites.
David Wentzloff: http://www.eecs.umich.edu/~wentzlof/

David Blaauw: http://blaauw.eecs.umich.edu/people.php?u=professor

Dennis Sylvester:
http://www.eecs.umich.edu/~dennis/


Eavesdropper

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Graphene molecular model image.


A new transistor made from graphene, the world's thinnest material, has been developed by a research team at the University of Southampton. The new transistor achieves a record high-switching performance which will make our future electronic devices, such as PDAs and computers, even more functional and high-performance. “Silicon CMOS downscaling is reaching its limits and we need to find a suitable alternative. Other researchers had looked at graphene as a possibility, but found that one of the drawbacks was that graphene's intrinsic physical properties make it difficult to turn off the current flow,” said Dr. Zakaria Moktadir of the Nano research group at the University. Dr. Moktadir discovered that by introducing geometrical singularities (such as sharp bends and corners) in bilayer graphene nanowires, the current could be turned off efficiently. According to Professor Hiroshi Mizuta, Head of the Nano group, this engineering approach has achieved an on/off switching ratio 1,000 times higher than previous attempts. “Enormous effort has been made across the world to pinch off the channel of GFETs electrostatically, but the existing approaches require either the channel width to be much narrower than 10 nanometres or a very high voltage to be applied vertically across bilayer graphene layers. This hasn't achieved an on/off ratio which is high enough, and is not viable for practical use,” he said. Dr Moktadir developed this transistor using the new helium ion beam microscope and a focused gallium ion beam system in the Southampton Nanofabrication Centre, which has some of the best nanofabrication facilities in the world.


Zero

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OK, so it can’t reach the energies produced at the LHC or Tevatron, but this is still pretty impressive. Engineers at a micro-electro mechanical systems conference that was held recently in Cancun, unveiled this tiny cyclotron device, which can speed argon ions down a 5-millimeter accelerator track. Their chip-size cyclotron can guide argon ions with around 1.5 kiloelectronvolts of energy down a 5-millimeter accelerating track before whipping them around a 90-degree turn. The system boosts the ions’ energy by 30 electronvolts. That’s not very much energy, but unlike its larger cousins, this accelerator has no need for bulky magnets and instead uses an electric field set up between parallel electrode guide rails to accelerate and steer its particle beam. Yue Shi, an electrical and computer engineering graduate student at Cornell University, constructed three versions of the accelerator; two on silicon-on-insulator (SOI) chips and one on a printed circuit board. Each had a straight, segmented acceleration track and either a 1-, 2-, or 4-mm turning radius. To test the design, she fired a stream of argon ions with around 1.5 keV of energy from a commercial ion source into each chip’s tracks. Electric fields between four segments in each chip’s acceleration track gave the ions a kick before they raced into the turn. Then another electric potential between two electrode curbs pulled ions around the bend. Only those ions with just the right amount of energy made it through. So, by detecting ions at the finish line, Shi confirmed that they truly got a boost. A few hurdles remain, including a more efficient way to grab ions from the 75-micrometer-wide beam. Lots of ions are lost in the transition, Shi said. But the device at least proves the concept that you don’t need humongous frozen magnets and cavernous spaces to speed up some particles.

 

Eavesdropper

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Gallium nitride material holds promise for emerging high-power devices that are more energy efficient than existing technologies, but these GaN devices traditionally break down when exposed to high voltages. Now researchers at North Carolina State University have solved the problem, introducing a buffer that allows the GaN devices to handle 10 times greater power. Previous research into developing high power GaN devices ran into obstacles, because large electric fields were created at specific points on the devices’ edge when high voltages were applied, effectively destroying the devices. NC State researchers have addressed the problem by implanting a buffer made of the element argon at the edges of GaN devices. The buffer spreads out the electric field, allowing the device to handle much higher voltages. The researchers tested the new technique on Schottky diodes and found that the argon implant allowed the GaN diodes to handle almost seven times higher voltages. The diodes that did not have the argon implant broke down when exposed to approximately 250 volts. The diodes with the argon implant could handle up to 1,650 volts before breaking down. “By improving the breakdown voltage from 250 volts to 1,650 volts, we can reduce the electrical resistance of these devices a hundredfold. That reduction in resistance means that these devices can handle ten times as much power,” said Dr. Jay Baliga, Distinguished University Professor of Electrical and Computer Engineering at NC State.


Zero

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The world of computing is in transition. As chips become smaller and faster, they dissipate more heat, which is energy that is entirely wasted. By some estimates the difference between the amount of energy required to carry out a computation and the amount that today's computers actually use, is some eight orders of magnitude. Clearly, there is room for improvement. One of the outside runners in the race to take the world of logic by storm is reversible computing. By that, computer scientists mean computation that takes place in steps that are time reversible. These requirements for reversibility place tight constraints on the types of physical systems that can do this kind of work, not to mention on their design and manufacture. Ordinary computer chips do not qualify--their logic gates are not reversible and they also suffer from another problem. When conventional logic gates produce several outputs, some of these are not used and the energy required to generate them is simply lost. These are known as garbage states. Himanshu Thapliyal and Nagarajan Ranganathan at the University of South Florida propose a new way of detecting errors in computations and say that their method is ideally applicable to reversible computing and, what's more, naturally reduces the number of garbage states that a computation produces. If a reversible computation produces a series of outputs, then the inverse computation on these outputs should reproduce the original states. So their idea is to perform the inverse computation on the output states and if this reproduces the original states, then the computation is error free. And because this relies on reversible logic steps, it naturally minimizes the amount of garbage states that are produced in between. The beauty of this approach is that it has the potential to be dissipation-free. So not only would it use far less energy than conventional computing, it needn't lose any energy at all. At least in theory. More information can be found here: http://arxiv.org/abs/1101.4222


Eavesdropper

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Later this year, Hewlett-Packard researchers say, they expect to deliver to the U.S. Army a working prototype of what they're calling a "Dick Tracy wristwatch" — a lightweight, wearable device that soldiers in the field can use to view digital maps and other data on a flexible plastic screen that won't shatter or crack like glass. Though it will be spartan by design, researchers say HP's prototype could be one of the first in a new wave of products incorporating flexible electronic displays. Freed from the constraints of a rigid glass screen, designers could one day build flexible plastic displays into clothing, wall coverings and perhaps even e-readers or tablets that can roll up like a newspaper. The process starts with rolls of plastic that has been treated with thin layers of metal and other material. The plastic is run through a press that imprints a microscopic, three-dimensional pattern, which can then be etched to create transistors on the film. These can transmit instructions to electrically charged particles or diodes contained in a second layer of plastic, which then displays text or images. Other groups in Taiwan and elsewhere are developing manufacturing processes in which layers of transistors are laid down on sheets of plastic temporarily bonded to a pane of glass. For more information please visit: http://www.siliconvalley.com/news/ci_17087989?nclick_check=1


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