Skip navigation

community

Embedded Systems

9 Posts tagged with the innovation tag
0

Joe Alderson reports from Embedded World 2012 in Nuremberg:

 

 

With a rare chance to leave the Farnell/element14 stand and take a trip around the rest of the exhibition, the final day of Embedded World 2012, intended for students and academics, really brought home the incredible level of knowledge among young engineers who are just finishing university and heading out into the work-a-day world.  Young engineers were present at many of the stands, demonstrating proficiency with the applications they were showcasing. Many of them had started with simple 8-bit MCUs, using boards like the Arduino Uno, and were now experts working with products from ARM, Intel, AMD, Microsoft and too many others to list.

 

Looking at the young people at Embedded World I was reminded that society has now seen multiple generations of computer gamers and, I’m relieved to say, these gamers have left a positive impact on today’s technology. One outgrowth of gaming-driven technology could be seen in the Microsoft exhibit, where the Xbox manufacturer was demonstrating projected touch screen technology (think of the film Minority Report), while plenty of the autonomous RC cars demonstrated elsewhere ran real-time 3D models and transmitted back camera feed from multiple angles.

 

One of the many great student projects that I saw included object recognition and augmented reality gaming, where real world objects were used as walls in virtual games with computer generated balls bouncing between them. Other young engineers, this time having constructed a giant chess playing robot guided by ultrasound, were keen to demonstrate how they had integrated Atmel’s 8-bit MCU and ubiquitous demo board (I’ll leave you to guess which one) into the motor control system.

 

As I checked out more and more development boards, their increasing level of connectivity really struck me and it’s no surprise that the Embedded World internet backbone was creaking under the weight of many thousands of web-connected demo boards, laptops and mobile devices. A mighty download speed of 9 kb/s made it quite challenging to get a true measure of the functionality of some of the more powerful development kits as they were running apps that relied on APIs from various Internet locations. However, given the popularity of touch screens (both capacitive and resistive) across so many different applications, I think it’s safe to say that the next 2 – 3 years will see massive growth in every day devices making use of this technology.

 

 

At the Philips stand, even the humble washing machine was interfaced with wireless connectivity and a touch screen in order to monitor and improve motor efficiency. I’d initially thought that the idea would be to implement smart control of the washing machine so that it could be activated remotely, but the real goal was increasing energy efficiency and extending the product’s life span.

 

This drive towards energy efficiency and green technology really impressed me at Embedded World this year, with many of the exhibiting companies placing emphasis on what you can do with only a couple of Watts, rather than what you can do by cramming a massive heat sink on your processor. Of course for this reason ARM seemed to be everywhere at Embedded World 2012. From the autonomous Zeppelin circling above the press area to the smart vending machine on the ARM stand to well over half of the development boards that we were showcasing, ARM cores were the most outwardly obvious sign of the emphasis shifting from energy hungry processors to silent, powerful and well designed cores.

2
The traditional approach to picking silicon involves data sheets; matrices of features; at best, a complex spreadsheet of all the many parts with all the many options laid out. Let’s call this the “top down” approach. You have to already be somewhat familiar with the universe of parts. Then you have to see if the part fits your need. Does it have SPI? Does it support JTAG? Can it support the touch capacitive screen your team wants? Even when it all comes together, how do you know that it can do SPI and JTAG simultaneously? What if those subsystems use the same pins? It’s ugly. You know it is.
Enter Solution Advisor from Freescale. Right now it covers the Kinetis MCU parts. This online tool takes a different approach. Let’s call it “bottom up.” Instead of attacking the problem from the top down perspective by starting with what we have, the bottom up perspective tackles the problem from your point of view. The question then becomes: What do I want? What do I need to do this? That basic assumption makes a world of difference. Suddenly you are freed from knowing anything other than what you already know: your design parameters. Hallelujah! That is good human-centered design.
So fill in the blanks. You need a segment LCD? Click and go. Need SPI capability? Just say so. Click the module you need on the left, and the Solution Advisor pops up a configuration window that lets you specify capabilities (Figure 1).

By Jim Trudeau

 

I admit it. I’m a sucker for a good human interface. So we’re going to depart from our usual software focus just a little bit. My excuse is that we’ll talk about a tool that gives you a better way to pick silicon based on a better human interface into the whole process. We are all about good solutions here.

 

The traditional approach to picking silicon involves data sheets; matrices of features; at best, a complex spreadsheet of all the many parts with all the many options laid out. Let’s call this the “top down” approach. You have to already be somewhat familiar with the universe of parts. Then you have to see if the part fits your need. Does it have SPI? Does it support JTAG? Can it support the touch capacitive screen your team wants? Even when it all comes together, how do you know that it can do SPI and JTAG simultaneously? What if those subsystems use the same pins? It’s ugly. You know it is.

 

 

Enter Solution Advisor from Freescale. Right now it covers the Kinetis MCU parts. This online tool takes a different approach. Let’s call it “bottom up.” Instead of attacking the problem from the top down perspective by starting with what we have, the bottom up perspective tackles the problem from your point of view. The question then becomes: What do I want? What do I need to do this? That basic assumption makes a world of difference. Suddenly you are freed from knowing anything other than what you already know: your design parameters. Hallelujah! That is good human-centered design.

 

So fill in the blanks. You need a segment LCD? Click and go. Need SPI capability? Just say so. Click the module you need on the left, and the Solution Advisor pops up a configuration window that lets you specify capabilities (Figure 1).

 

http://freescalehome.files.wordpress.com/2011/08/image1.jpg?w=578&h=276

 

Figure 1. Pick the capabilities the product design requires.

 

 

You can specify voltage, temperature range, package, and memory. The FlexBus interface is particularly sweet, and worthy of a picture (Figure 2). Again, we’re talking an intuitive human interface here that lets you define what you need based on how you think and see, not on a dry list of numbers or register diagrams

 

http://freescalehome.files.wordpress.com/2011/08/image2.jpg?w=578&h=336

 

Figure 2. Specifying the characteristics of the bus that ties everything together.

 

 

You mix and match the design elements as you will. The list of potential controllers that fit your needs changes automatically based on your choices. If it drops to zero, you are warned immediately – yet another great human interface touch (Figure 3).

 

Figure 3. Uh oh! Now you’ve done it.

 

 

When you’re done, you can pick a 100 percent solution, or a non-preferred solution (you’re a grown up). Once you’ve picked the processor, you can check the pin muxing to see if your particular choice of modules work together (Figure 4). Talk about cool – within a minute or two you know if your design is going to have problems. (I purposefully set this up to show you a failure case.)

http://freescalehome.files.wordpress.com/2011/08/image4.jpg?w=578&h=271

Figure 4. Sorry, these components won’t play together in the same box.

 

 

Continue reading on Software Meets Silicon blog

1

5 times the density in ICs

Posted by Eavesdropper Mar 29, 2011

theincredibl.png

 

Copper based ICs have reached nano-meter densities, with wire so small, that no current seizes to flow. The University of Cambridge professors John Robertson and Santiago Esconjauregui have devised a possible future solution. They are growing Carbon Nanotube in greater density than ever before, up to 5 times the most current working technology.


 

Through the annealing step, the deposit of catalyst onto a substrate are heated creating groupings of nanoparticles. The next step grows the nano-tubes. Normally, this process does not yield tubes that can carry sufficient amounts of current for use in ICs. But in the professor's case that place multiple deposits and annealing, produces bundles of nano-tubes capable of handling the current necessary. They claim that even higher densities are possible.


 

This is good step towards Carbon Nano-Tubes replacing copper in microchip manufacturing, but controlling the positions and laying out an actual circuit with Robertson and Esconjauregui's achievement has not been shown. And, they are only 2 people.


 

Which brings me to a realization. With so many people working with carbon nanotube and like technology, they all need to be pulling in the same direction. A global initiative will take us all into the future, now. Just a thought.


 

Eavesdropper

3

Self-repairing processor

Posted by Eavesdropper Mar 21, 2011

crisp-self-repairablechip-1300474079.jpg

 

CRISP has developed a multi-core processor that will test and repair itself, sort of. There is an on-board resource manager that will test to see if a core is malfunctioning, and if so, send the tasks to a functioning core. The idea is to create a chip that will always work 100% of the time regardless of internal component failures. ‘‘Because of the rapidly growing transistor density on chips, it has become a real challenge to ensure high system dependability. The solution is not to make non-degradable chips, it's to make architectures that can degrade while they keep functioning, which we call graceful degradation. With the right dependability infrastructure many-cores can be a solution', says Hans Kerkhoff accociate professor at the University of Twente.


 

Still in the design, prototype, stage, this technology may very well be the standard future of chip design. My old critic is what is the "resource manager" gets corrupted due to a bad core? I'm sure more details will emerge over time on how they will handle such events.


 

CRISP stands for Cutting edge Reconfigurable ICs for Stream Processing. It is a collaborative effort from the University of Twente, Tampere University of Technology, Thales Netherlands, Recore Systems, Atmel, and NXP at the moment.


 

Eavesdropper

1

 

 

materials_breakthrough_image.jpgthermal material system.jpg

 

“As electronics become more advanced, we are approaching the point where conventional materials like copper can’t take the heat. For computing to go faster and electronics systems to become more capable, better cooling solutions such as GE’s prototype substrate will be required to allow this to happen,” says Dr. Tao Deng, a senior scientist at GE Global Research.


 

 

GE and DARPA are teaming up to create a new "Phase-Change" material that in its prototype form demonstrated 2x thermal conductivity of copper at 1/4th the weight. The material is also able to withstand 10x gravity environments. Since this is a military endeavor, the gravity requirement means this will be used about aircraft. An additional unique feature brings "surface engineered coatings that both repel and attract water." Condensation will become less of an issue. Often, waterproof coatings on PCBs are used in military devices, but could wear away or peal under certain circumstances.


 

 

Dr. Tao Deng's blog has just started, I will keep an eye on this one to bring more breakthroughs and announcements as they happen.


 

 

Eavesdropper

0

1_s.jpg2_s.jpg

 

The purpose is to watch the person who made the lunch, make it, while you eat it. And also, so the preparer can watch you eat it. A never ending cycle. Researchers at Ochanomizu University have embedded a camera and LCD touchscreen into a lunchbox (bento). The video starts playing as soon as the box is opened, and likewise, recording begins. The team wants to make the camera smaller and add a bit of video editing ability to the lunchbox (a sentence rarely uttered in history). 

 

The teams purpose is to spread the love on making and enjoying the lunch, but they fail to see the real potential. Watching TV shows, movies, youtube videos over lunch. I'm sure this device will pop up in the news again, in a leaner, better form. Good luck researchers.

 

Eavesdropper

6

xim3production0.jpg

 

The XIM 3 stand for XBOX Input Machine version 3. For those  who do not know, the XIM 3 allows for a keyboard, mouse, joystick, and other USB based devices to be adapted to the console. But that is not the end of the device's features. In many games a little autoaim functionality is added to help the player aim using a controller, since the controller is not the most precisely controlled input device. The XIM 3 has onboard software called "Smart Translators" that takes a particular game's aiming and movement actions and attempts to remove any autoaim and movement aids to give a PC like keyboard and mouse feel. Let's take a look at this achievement from the inside.


SDC11274.JPGSDC11275.JPG

 

The device is stylish and does not feel cheap. The casing, a dense plastic, sits the screen at an angle allowing the player to see the information while seated as if at a desk, within the LCD's viewing angle. 3 A type USB ports are on the back for, presumably, a keyboard, mouse, and XBOX controller. The XBOX controller is needed, ultimately, for sending the control signals to the console. The XBOX addresses a controller and expect signals. The XIM piggybacks on the controller signal. A mini usb port is present for a connection to the XBOX console itself. A barrel plug for a power adapter is also present, which may be needed at a user adds a USB hub for more devices.


SDC11277.JPG

 

The XIM 3 shell is held together with 2 visible screws and two underneath foot-pads. Inside shows the screen ribbon cable connected to the mainboard on the base. The screen model number is SG100331. Ribbon cable is marked TS8001S FKJ40010 V1.0. The LCD is a QVGA panel


SDC11278.JPGSDC11280.JPG

 

The mainboard has a model name HDDC3C02 made by HDDC inc. No information could be found on the company or model number. However, the central microcontoller is a NXP - LPC1768FBD100. A cortex M3 100Mhz 32 Bit ARM processor with 65KB RAM and 512KB program memory space. On the mainboard is a Texas Instruments TUSB2046B 4-port Full-Speed USB Hub, hence XIM3's 4 ports. (The hub requires 3.3V, the assumption is that the NXP ARM is also run at the same voltage.) Also present is a MAX3421EE USB peripheral host controller with SPI interface. This controller digital logic and analog circuitry necessary to implement a full-speed USB peripheral, or in this case the T.I host controller. (Supply voltage for the MAX chip is also 3.3V) Not to surprise anyone, but a LD33 F022 (3.3V) linear voltage regulator powers the whole system. My only complaint about the system are the experience I had with the 3 main USB ports. It was easy to bend a pin out of place, impeding cable inserts. However, I bent the pins back in place, and all was well.


SDC11279.JPG

 

 

There is no additional memory, so the entire program sits in 512KB. Overall, it is an impressive design, circuit, packaging, and the code must be exquisite. This is an example of only one person accomplishing an amazing feat on his own. Inspiration to all of us and our ideas.


 

XIM 3 units are finally available at the XIM Technologies website on a regular basis. When the XIM was first released, the attention and web traffic was so great that it crashed the servers. After the website's servers were upgraded, "OBsIV" the creator of XIM, would only open the store privately for short periods, like 5 minutes. The only way to the store was knowing the direct address, and was not available from the home page. Some people were using other services, like "alertbox," to monitor when the site would open. Eventually, everyone who desperately wanted one, now has one. For the record, the one pictured above was purchased in a 5 minute window in February.


 

Want to know how the device performs in games? I will relate my experiences in an up and coming post.


 

Cabe

0

 

Missouri University of Science and Technology is resolved to make a handheld scanner that can see through anything. Similar to airport scanners, this hand held camera used millimeter and microwave signals to peek inside. In real time, this camera takes 30 frames per second and can construct a representation of objects at different layers. No word on the depth it can go, but the team calls it “non-intrusive.” Originally conceived Dr. Reza Zoughi in 1998, the first prototype was made in 2007. Since then the design has been made smaller and more portable. Currently the system runs off of a battery about the size of a laptop power cell. Zoughi said about the product’s future, “Further down the road, we plan to develop a wide-band camera capable of producing real-time 3-D or holographic images." As of 2010, this concept is patented. At the moment, objects to be scanned have to pass between the camera and a backplane. The team is hard at work to eliminate the pass through feature and just make it a camera. Although modesty will soon be a thing of the past, it is an impressive achievement.


Eavesdropper

0

29894_web.jpg

A complete computer system in 1 cubic millimeter. Onboard is a low power microcontroller, memory, battery, wireless radio, solar cell, and a pressure sensor. This system is meant to be an implantable eye pressure monitor for glaucoma patients. I'm sure a patient would feel this think, despite the size. Think about getting a splinter. Created by three professors from the University of Michigan, Dennis Sylvester, David Blaauw, and David Wentzloff, the project was presented at the International Solid-State Circuits Conference (ISSCC) in San Francisco.

 

"Our work is unique in the sense that we're thinking about complete systems in which all the components are low-power and fit on the chip. We can collect data, store it and transmit it. The applications for systems of this size are endless," Sylvester said.

 

Blaauw said, "When you get smaller than hand-held devices, you turn to these monitoring devices." He continued, "The next big challenge is to achieve millimeter-scale systems, which have a host of new applications for monitoring our bodies, our environment and our buildings. Because they're so small, you could manufacture hundreds of thousands on one wafer. There could be 10s to 100s of them per person and it's this per capita increase that fuels the semiconductor industry's growth."

 

Wentzloff, speaking of the onboard antenna, "This is the first integrated antenna that also serves as its own reference. The radio on our chip doesn't need external tuning. Once you deploy a network of these, they'll automatically align at the same frequency."

 

The system uses an aggressive sleep mode scheme. It wakes every 15 minutes to take readings at about 5.3 nanowatts. The battery charges in 1.5 hours of sunlight, or 10 hours of indoor lighting. But if it is implanted, how can this happen? It can store up to a week's worth of data.

 

See more about the team at their personal sites.
David Wentzloff: http://www.eecs.umich.edu/~wentzlof/

David Blaauw: http://blaauw.eecs.umich.edu/people.php?u=professor

Dennis Sylvester:
http://www.eecs.umich.edu/~dennis/


Eavesdropper