We are presenting a webinar today: What’s New in Autodesk EAGLE 8.4: SPICE, Live DRC, and more
Click the above link to attend.
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EAGLE is taking us where no PCB design software has gone before with its MCAD integration, watch the video (below) to get a taste for what is possible. Don’t limit your imagination with outdated software, get the bundle (EAGLE Premium and Fusion 360 Standard) and expand your design horizons.
Learn more about using EAGLE with Fusion 360, join us and watch our live webinars to see ECAD <=> MCAD integration in action.
Autodesk EAGLE: Electrical and Mechanical Workflow
For this webinar we will be covering:
For a very long time there has been an increasing demand for the capability of exchanging design file within an Electronic Design Application and a Mechanical Design CAD system. That has now been resolved with the latest release of Autodesk EAGLE. This new system allows users to fully interpolate files between EAGLE and the well known mechanical solution by Autodesk called Fusion360. Please follow Edwin Robledo and Jorge Garcia as they guide you at the best practices to optimize your workflow between EAGLE and Fusion 360.
What Attendees Will Learn:
Sep 26, 2017 7:00 PM IST (Europe/Dublin)
Oct 24, 2017 7:00 PM IST (Europe/Dublin)
Mapping 3D models to EAGLE parts
For this webinar we will be covering:
For a very long time there has been an increasing demand for the capability of exchanging design file within an Electronic Design Application and a Mechanical Design CAD system. That has now been resolved with the latest release of Autodesk EAGLE. This new system allows users to fully interpolate files between EAGLE and the well known mechanical solution by Autodesk called Fusion360. Please follow Edwin Robledo, from the Autodesk EAGLE support team, as he will teach us exactly the fundamental concepts necessary to map your EAGLE components to 3D models. Providing you the capability of pushing your design projects to Fusion360 in 3D editable format.
What the Attendees Will Learn:
Sep 19, 2017 7:00 PM IST (Europe/Dublin)
Oct 17, 2017 7:00 PM IST (Europe/Dublin)
If you haven't explored the new EAGLE 8.3 software yet here's some of the features to look out for.
Online Library Editor
3D Models in Libraries
Sync Board with Fusion
Editing 3D PCB in Fusion
Learn more in this blog post.
I've recently started testing out the latest version (v8.3.1) of EAGLE Premium, and one of the features I was really interested to try out since I first saw v8 earlier in the year was the BGA Router. Breaking out BGA's is time consuming so if that effort can be reduced then that's a big bonus. On the other hand, I don't like autorouters and the results are never anything close to the standards I set for myself when routing by hand, in fact many of the boards I do would be impossible to autoroute satisfactorily, so any automatic BGA breakout is going to have to do a better job than your typical autorouter does. So lets see what happened when I devised some tests and took the BGA Router for a spin!
Spoiler Alert: You will have to put some effort into setting things up and do some manual clean up in order to get a satisfactory result in the end.
I decided that to keep things simple I would create a very specific test schematic which would allow me to focus just on the BGA breakout without any other distractions going on around the board. I created a simple schematic which has an FPGA in a 256-ball package, with all the I/O pins connected to surface mount test points and all the power pins connected up to appropriate power rails. The idea being it would allow me to determine how nicely it routes out and how well it deals with the very important task of connecting power to the device, without any other distractions with unrelated components and routing. In this example I have ignored decoupling capacitors but these would be placed on the bottom side of the board anyway and likely wouldn't have too much effect on the placement of any vias if placed correctly.
For this test I have chosen to have a 6 layer board. I'll use the inner two layers for GND and +3V3 and then have an area fill on the bottom layer for +1V0. I could likely do a split power plane on layer 4 for +3V3 and +1V0 but to keep it simple I will just put it on the bottom layer. I want to have microvias available for layers 1-2, 2-3, 14-15, and 15-16 as well as buried vias. In order to set this up I need to go into the DRC and configure the layer setup as follows:
Note: Ignore the Copper and Isolation thickness settings as I haven't set these up as they not going to affect our example.
I also set the clearances to be 4mil, minimum track setting to 4mil, microvia drill to 4mil, regular via drill to 10 mil etc to enable sensible via geometries. I won't include details here as they are just part of normal routing setup and not specific to using the BGA router. However, you must make sure you have these set up properly so that you can route our from the BGA without incurring DRC errors otherwise it will not route.
After setting up the board I decided that the first thing I should do would be to manually route out the BGA so that I can give a baseline for comparing the results from the BGA Router. As this is a relatively small BGA at just 256 balls with a very generous 1mm pitch this didn't take too long to achieve. Setting the grid to 0.5mm I started by breaking out the outer row of balls all the way round on the top layer, then continued round and did the second row. There were still available routing channels so I went ahead and routed as many from the next row around as I could through the remaining routing channels. After routing out the top layer we have the following:
Now it was time for the layers which require vias. The test board is set up for microvias and we shall use via-in-pad as this is quite a common technique when routing out BGA's. Setting the via drill to 4mil we proceed as before working around the device and adding in the routes into all the available routing channels on layer 2. The only caveat here is that if there is a BGA pad on the top layer relating to one of the power or ground pins then we shall not route underneath that and will leave the routing channel free. I could have put the power breakout in first but I decided to leave that until last to keep the pictures clearer for illustrating the breakout of the main I/O signals. The result of routing out on layer 2 is as follows:
We still have some unrouted I/O pins. There aren't many (a handful for each side) and they could be routed out on layer 3 using stacked microvias underneath the BGA pads, but I want to keep layer 3 clear and unbroken for the GND signals (slots in the GND plane where other traces go has negative impacts on signal integrity as signal return currents have to find a less direct path). What I chose to do instead was to have staggered vias, a microvia in the BGA pad to layer 2 and then a 2-15 via offset from the microvia and route the signals out on layer 15. I approached this in exactly the same way as routing out the other I/O signals and worked my way around the device until they were all routed in. The result of these final I/O signals being routed out is as follows:
Next it's the turn of the power and ground signals. Connecting up the GND net is easy, I simply put stacked microvias 1-2 and 2-3 to connect the GND pads up to the GND polygon on layer 3. For +3V3 and +1V0 I used a combination of microvias and staggered 2-15 vias to get these signals to the polygons on their respective layers. The finished result of manually breaking out the BGA is as follows:
The first time I tried the BGA Router, I set up the board and ran the BGA Router and just set it off running without any additional configuration. It took almost 4 hours and the results were less than stellar. This was however to be expected as the router didn't have enough information by default to be able to do a good job. First things first, set the various nets to only route on their appropriate layers. Open up the BGA Router and the BGA Settings window will be displayed as follows:
Press the Edit BGA button and the following window will be displayed:
The I/O's will be allowed to route on layers 1, 2 and 15 so we will group select the I/O pins and press edit to alter the setup. We then select the layers as required and press OK. The layer setup window is as follows:
We repeat the same for GND, +3v3, and +1V0 with the windows as follows:
After letting the BGA Router finish its routing run which took around 10 minutes (I didn't time it unfortunately) the result was as shown below:
On first glance the BGA Router seems to have done ok. It's used the correct layers for the IO, the same as I had used in my manual breakout, and although they are a little less tidy than my hand crafted version they are all in and going in the right direction which is nice.
On closer inspection of the power net routing though we soon uncover something a little wrong....
Whilst I have told it to only route the GND, +3V3, and +1V0 on layers 3, 14 and 16 respectively, it has decided to route between BGA pads on layer 1 to connect some of these together and then only going down to the plane with vias in a limited number of places. This is a little disappointing and limits the usefulness of the BGA Router as it stands but this is something that I am sure Autodesk will be able to fix quite easily in a future update.
It is also not possible to control the via type and breakout type to give me the same control as if I am manually routing out the BGA. For example, I might want to use microvias but not have via in pad. Currently with the BGA Router, if I select microvia it will use via in pad, unless standard vias will fit in the space between pads and then it will use those instead in a staggered breakout arrangement. It's not possible to have a staggered breakout with micrivias. This isn't the end of the world, but again is a limiting factor if you are trying to keep the board technology as manufacturer friendly as possible.
The BGA Router is an interesting addition to EAGLE. It is better than I had initially anticipated based on my lack of fondness for autorouters in general, and whilst it doesn't do a perfect job, as good as I can do manually, it is certainly usable and I think with some more development could become a very powerful tool to speed up the layout process. Currently, it's good for breaking out I/O nets, although it doesn't do as neat of a job as I can do by hand if you compare my original hand routed breakout against the result from the BGA Router.
Where it currently falls apart is routing out power nets. Connecting power pads together with traces on the top layer rather than taking each one down to their respective plane with vias is not acceptable, especially when routing for those nets have been turned off for the top layer. So for now, I will be either sticking to routing the power nets by hand or going in and doing lots of manual fix ups afterwards.
In general though, on a large BGA, if you don't have the time to spend manually to make it look pretty, breaking out just I/O connections with the BGA Router in EAGLE v8 could be a significant time saver. I think there are definitely things they can do to improve things, more info about why things didn't route out correctly for example and more guidance on getting the setup right in the first place, but I think as it is it is still a valuable tool to have to hand.
One other word of warning. If you try to use this tool and you already have some routing on your BGA, you will very likely end up with EAGLE crashing and closing. This is a known issue with the current version (v8.3.1) which I am sure will be corrected in a subsequent release.
This concludes the my overview of getting the BGA Router of EAGLE v8 to behave. Let me know what you think in the comments below and if you have any questions please feel free to ask!
The new version is here! If you have a subscription then just download the update and start exploring. Here's a quick run down of the new features in Autodesk Eagle's biggest release so far. First though I would suggest watching this video first if you haven't already seen it, a quick paced overview showing the integration possibilities between EAGLE and Fusion 360.
Previous versions of Eagle used a collection of lines and shapes to define a board outline. Now there is a true board object that will power Eagle and lay the foundation for more powerful ECAD/MCAD integration in future releases. When opening an existing Eagle designs bounding boxes will be used to automatically create the new board outline with enclosed bounding boxes assumed to be cutouts. The new board object can even be edited within Fusion 360 bringing the power of advanced mechanical design tools.
The birth of a new feature to help visualise your board and see statistics in a more accessible manner than previously possible. Examples of statistics include minimum feature trace widths, spacings, drill sizes, annular rings, board to copper clearance and soldermask swell. Visually see the soldermask over traces, just like on your manufactured board. Rotate in 2D and quickly isolate different layers to help generate documentation, notes, marketing material and more.
Collaboration is the name of the game. With the brand new Fusion 360 integration you can incorporate PCBs directly into mechanical product designs. Going far beyond just a 3D PCB viewer, integration allows bi-directional data sharing between the PCB and product design and collaboration with the wider team.
Lots of individual features go into making up the integration, lets take a look.
The new managed libraries come with 3D models properly aligned on footprints (land patterns), edit libraries to include models and enhance your own libraries in the same way.The new online library editor enhances your parts library ready for integration with Fusion 360 to bring your design to life. Devices with an online 3D model will be marked with a new icon letting you know the device is complete.
Link your PCB with a Fusion 360 design (generating a Fusion PCB file) to get an accurate 3D representation of your electronics within the overall product design. It is possible to start off a design from Eagle, from Fusion or join up two existing designs, the choice is yours. The 3D models from the library are used to render your PCB design within Fusion. For complex product designs the PCB shape and mounting points can be extracted to create your Eagle PCB, no need to re-draw the board outline and be sure it will fit. The 3D model will allow you to check the fit in full 3D along with connector positioning and any other critical factors. Product design is an iterative process, if the enclosure for the PCB needs adjusting you can change the board outline and reposition components from within Fusion and push those changes back to Eagle.
Cut through the clutter! Add focus to your interactive routing with active layer mode. Press shortcut Shift + S and the layer you are on becomes the active layer. Other layers become greyed out or hidden depending on your preferences. Compared with the current process of having to invoke the layers panel and turn layers on and off this new feature is a real time saver.
This feature is ideal for multi-layer boards and will boost your productivity. See just what you need, distraction free, to be able to interactively route with all your concentration on the active layer making it easier to determine paths, the flow of traces and how to optimise existing routes.
The Fusion Team Collaboration tool makes it easy to review you design in 3D right from your browser. Share links with others and collaborate with markup tools including text and callouts. A documentation, design review and collaboration tool you can use on any device with a modern browser including desktops, laptops, tablets and phones. Simply push your design into Fusion 360 to make it available. User's don't need Eagle to see and appreciate the brilliant design you you have done!
This is a really great short and fast paced video demonstrating the upcoming integration between EAGLE and Fusion 360. It highlights some of the things made possible by integrating electronic and mechanical CAD.
Get ready for an amazing EAGLE release. Major upgrades and new functionality are on the way to a desktop near you so keep that subscription current, this is one you really don't want to miss out on. We can only give you a sneak preview at this stage but it really will be worth the wait.
For the big picture think Smart and Functional - the merging of electronic (smart) and mechanical (functional) for truly integrated intelligent product design.
Want to know more? See some of the advanced interoperability and new features in this preview video.
And what is even more amazing, for just $400 per year (approx) you can have these amazing advanced tools allowing you to perform full product design on your next great idea. Subscribe to the future, order your and licenses now.
I used negasilk.ulp for a while for inverted silkscreen, but I decided to enhance it a little and make it easier.
1. First create your art work (Polygon in top layer with text inside it on layer 41 tRestrict with vector font type).
2. Run Ratsnest.
3. Name the polygon with "NEG_SILK" to make it special from other normal polygons.
With this enhancement there are no need to run any script file and also can help you to add negative silk screen within a design has already other polygons.
This ULP makes creating packages for libraries much easier. You can use is to draw multiple SMDs/PADs, lines and rectangles
PAD Dialog has the following options:
SMD Dialog has the following options:
See how to use it in this video
EAGLE has been making headlines these days after teaming up with Autodesk back in June 2016. And the question on everyone’s mind is the same - what is going to change?
This popular PCB design tool has been around for nearly 25 years, and has gained a huge following over time for two reasons - the free version of EAGLE can satisfy most basic electronic design needs, and it’s FREE. But with Autodesk at the helm now, things are definitely changing. For the good or the bad? Let’s find out.
We recently got our hands on the latest build of EAGLE, now called Autodesk EAGLE. On our first crack it’s clear to see that things are certainly different, but not in a bad way. While Version 7.7 focused on adding some new Autodesk manufacturing features, this release digs deep into the EAGLE engine to improve schematic editing, PCB layout and design reuse with several new features.
The router in EAGLE finally feels a bit less manual, and we were treated to some fancy interactive routing tools that bring PCB layout up to speed with other offerings, including:
Yeah, routing a BGA is a huge pain, and usually takes hours, but Autodesk EAGLE wants to do away with this nonsense. The new BGA Fanout in this version allowed us to escape all of the nets on a high pin-count BGA in seconds. Needless to say, we love it.
For those that find themselves wanting to reuse circuitry easily between multiple projects, now you can. The new design blocks in Autodesk EAGLE allow you to quickly copy and paste circuitry between multiple projects. And the best part? Any changes you make to said circuitry stays synchronized between schematic and PCB.
Our initial first impression with the new Autodesk EAGLE? Definitely a step in the right direction with some much needed improvements. We’d still love that 90s UI to get a new coat of paint, and maybe an easier way to get our designs into a mechanical tool. But for now, Autodesk seems to be heading in the right direction with EAGLE, and very quickly. Now how about that new pricing...
For nearly thirty years, EAGLE has had the same pay-once-for-everything pricing. Basic updates would roll in every 2-3 years, and things would just kind of coast until the next release. Not anymore. Starting with Autodesk EAGLE, the software is now being offered as a monthly or yearly subscription.
We were incredibly curious about this change, and also a tad skeptical. So we reached out to Matt Berggren, Director of Autodesk Circuits, to get to the bottom of this. Here’s what Matt had to say:
“It just made sense. We’ve always wanted PCB design software to be accessible to every engineer. Making this possible with your traditional pay-once-for-everything pricing just didn’t make sense for what we have planned in the future for EAGLE. I don’t think anyone can take offense at getting more updates, better support, and pricing that ends up being way more affordable.”
The Autodesk EAGLE team has been very transparent about what they have planned for the future of EAGLE, with plans to add:
Alright, time to talk numbers. Here’s how the new EAGLE Subscription breaks down, With the Standard Subscription at $15 per month, that’s $.50 cents per day. Not bad, but what about the Premium Subscription? About $2.17 per day. Your average cup of coffee in the good ol’ USA (without milk)? $2.70. That’s not bad at face value for a design tool that someone can make a living off of.
There’s no denying that this is a huge change for EAGLE. But we have to admit, it makes sense on paper, with most people making do on the $15/month plan. With EAGLE steadily making strikes to include more premium features, it’s now up to Autodesk to deliver big on their promises. Can they do it? We’ll be keeping a very close eye on EAGLE to find out.
For those already convinced, you can head on over to our Autodesk EAGLE homepage to purchase the new EAGLE Subscription. If you need some more time to decide, you can download Autodesk EAGLE now and give it a spin for free.
If you look at the Interconnnecting and Packaging Electronic Circuits (IPC) document IPC-7351, it appears that the footprint (PCB land pattern) required for any given SMD component will depend on the soldering method used in the underlying PCB assembly procedure. Specifically, Reflow Soldering will require a slightly different land pattern than Wave Soldering for the same device.
Now there is a naming convention for IPC footprints, of which RESC2013X65N is an example. Such a name does not appear, on the face of it, to have any field to distinguish which soldering method is foreseen for it. Furthermore, such names are in use in package definitions in Eagle Libraries, without any indication even in the comment lines about the soldering procedure foreseen.
Do potential users of the Eagle Libraries, for example those made available by Element14, just use those footprints without question or is there a commonly held understanding about the assumptions used to define the geometries of the land patterns?
Many thanks for any light you may be able to cast on this,
i cant find this two component in the eagle library which is S3LP307L and S3HP157L can anyone help me thanks
could anyone help me with an lbr file for Vishay optcupler It would make my life much easier I have just downloaded the latest.lbr file but it did not contain this element
Thanks in advance!
The electrical and the mechanical CAD industries belong together, but the communication between these two has been always difficult. Today's product design cycles benefit from close collaboration between the electronic engineers and the mechanical engineers. However in the current state of affairs moving a design between both realms is often difficult. Details are lost in translation, limiting productivity and collaboration between these two worlds. An end-to-end solution will reduce costs, respins and faster product development.
Bridging this gap, Cadsoft is partnering with Autodesk in order to integrate EAGLE with their recent MCAD offering, Fusion360(http://www.autodesk.com/products/fusion-360/overview). With just a few clicks of your mouse, moving your electronic design from EAGLE to Fusion360 is a simple process, using the IDF-to-3D tool(http://www.cadsoftusa.com/eagle-pcb-design-software/partner-products/3d-visualization/). The end result is that the mechanical engineer receives an accurate 3D model of the EAGLE PCB design. This model can be used to check enclosure clearances or perform thermal analysis among other things.
Fusion360 is a powerful 3D modeler that provides in-depth documentation to bring a new user up to speed quickly. It provides tools for parametric modeling, rendering, 2D drawing, and much more. Users can also perform mechanical simulations on their design objects to make sure they are structurally sound before any product is made, saving you costly redesigns.
Whether you are working on your own or in a team, this integration can help you finish your designs on schedule, at lower cost and with less errors. Both EAGLE and Fusion360 are very affordable tools that are well supported both commercially and in the maker community. For more information on these tools visit our website (http://www.cadsoftusa.com/eagle-pcb-design-software/partner-products/mcad-products/ecad-mcad-design-suite/).
Get a free 30 day trial of EAGLE here(EAGLE Free Trial has now ended ).
Is there a way to import Attribute & Value Information for library parts in Eagle(I'm looking for ULP's right now)?
Hi All, this is my first post on this forum.
I have a question about a board that i just design, is basically a breakout board for an Atmel 2560 with pin header.
Now i have to embed this board into another board , is there a way to convert the board into a library componet without re-assign 100 pin in a new Package, Device etc ?
Thanks in advanced