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Autodesk EAGLE

1 Post authored by: jagm32
Hi,   If you look at the Interconnnecting and Packaging Electronic Circuits (IPC) document IPC-7351, it appears that the footprint (PCB land pattern) required for any given SMD component will depend on the soldering method used in the underlying PCB assembly procedure. Specifically, Reflow Soldering will require a slightly different land pattern than Wave Soldering for the same device.   Now there is a naming convention for IPC footprints, of which RESC2013X65N is an example. Such a ...