Android Open Accessory Application (AOAA) Kit

Version 9
    OM13036,598 Android Open Accessory Application (AOAA) Kit
    OM13036,598 Android Open Accessory Application (AOAA) Kit diagram
    OM13036,598 Android Open Accessory Application (AOAA) Kit
    • NXP's LPC1769 ARM Cortex-M3 microcontroller in 100-pin LQFP package, with 64 KByte internal SRAM and 512 KByte internal FLASH.
    • 12.0000 MHz crystal for maximum execution speed and standard serial bit rates, including USB and CAN requirements. The LPC1769 runs at frequencies up to 120 MHz.
    • USB Host interface for Android connection
    • USB Device interface
      • Future proof for when Android devices can be USB Hosts also
    • Other communication interfaces:
      • 100/10Mbps Ethernet interface
      • CAN interface (DSUB9 and RJ45 connector pads exist, not mounted per default)
      • Serial Expansion Connector, 14-pos connector with UART/I2C/SPI/GPIO pins
      • Pads for interfacing NXP/Jennic RF module (JN5148-XXX-M00)
      • Socket for Digi™ XBee RF module and interface compatible modules
    • IO and peripherals:
      • Two RGB LEDs
      • Two push buttons
      • Analog input with trimming potentiometer
      • Eight protected inputs/outputs (of which four can be analog inputs)
      • Four open collector outputs (for driving for example relays)
      • All free LPC1769 pins available on expansion connector
      • UART-to-USB bridge that also supports automatic ISP (for program download via UART/USB)
      • 32 kbit I2C E2PROM for storing non-volatile parameters
    • Powered via Android device’s normal USB power plug
      • 5V DC external supply can also be connected via standard 2.1mm power jack
    • SWD/JTAG connector
      • 2x5 pos, 50 mil/1.27 mm pitch, standard SWD/JTAG connector
    • Small prototyping area
      • 100 mil pitch matrix of holes, 64 x 23 mm in size
    • Compact size of complete board: 135 x 100 mm (5.4 x 3.9 inch)
      • Four layer PCB design for best noise immunity