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    Introducing the Difference Between a System-on-a-Chip (SoC), a System-in-a-Package (SiP), and a Computer-on-a-Module (CoM)

    Integrated Circuit (IC) technology has progressed over the years to allow manufacturers to incorporate several subsystems on a single die that already contains a single or multi-core processor. Computer and communications companies have driven this trend for the last several decades to produce all-in-one and embedded packages that are, or are close to, an entire computer or electronic system on a chip. SoCs, SiPs, and CoMs can be found in everything from smartphones to automated systems, and their applications are endless. While they may look the same and offer similar functionality at their roots, SoCs, SiPs, and CoMs are different in several aspects. The purpose of this article is to explain those differences and provide an overview of their key technologies.

     

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