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  Why is the package type usually one of the last considerations when selecting an MCU or processor? An inefficient package can present issues to project schedule, system performance, board size and most importantly cost.   Luckily, the i.MX RT crossover processors cater to the PCB layout engineer. In package development, we perform several pinout iterations, conduct package fan out exercises for 2-layer PCBs on our LQFP packages and 4-layer PCBs on our BGA packages and finish by act ...
kjachim

i.MX RT Saves the Day

Posted by kjachim Mar 15, 2019
  During the development of a new product, have you ever been asked at the last minute to include more features?  Add a smartphone-like GUI, make it adapt with machine learning, connect it to the cloud, and the list goes on and on.  The challenge for us engineers is that there is always a caveat – add these new features, while reducing the cost and shrinking the size.   This common engineering challenge can bump up your processing needs from a simple, low cost microcon ...
Partnership to deliver performance-optimized solutions to connect 5G everywhere BARCELONA, February 20, 2019 – Mobile World Congress 2019 –NXP Semiconductors N.V.  and Movandi, a privately held company with a mission to revolutionize 5G everywhere, today announced  that they have formed a joint partnership to collaborate on millimeter wave (mmWave) solutions for 5G networks. The partnership will combine NXP’s digital networking and signal processing portfolio with Mo ...

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