I am planning a breakout board for an BGA chip and have so many decisions, that I would like to get some input from the community.
The BGA is a 5mm x 5mm 24-ball BGA (pin A1 is missing). The device is the VLSI VS23S040 Composite Video/RGB/VGA + Memory controller.
To make the part usable I would add the crystal and bypass capacitor to the breakout board.
Some options that make sense to me are:
- 2.54mm (0.1") pitch, pins on 4 sides: 18mm x 18mm size, easy to handle and solder, not so easy to test. Not testable with horizontal pogo pins.
- 2.54mm (0.1") pitch, pins only on 2 opposite sides: 32mm x 10mm size, to be usable on a prototype board, the pins could only be on 2 sides. This would make the board unnecessary big, but more versatile.
- 2mm (80mil) pitch, pins on 4 sides: 14mm x 14mm size, would give the smallest area footprint and be still easy to solder. Not testable with horizontal pogo pins.
- 1.27mm (50mil) pitch, pins on 4 sides: 9mm x 9mm size, BGA only without crystal. Smallest size ever.
- 1.27mm pitch, pins on 2 sides: 16mm x 8mm size, very small with crystal and testable with pogo pins.
Ideas for any other configurations. Please tell me in the comments
Thanks for having an opinion.
PS: I was hoping the image are comparable scale, but they are not.